Image sensor, manufacturing method, and electronic device

ABSTRACT

The present technology relates to an image sensor, a manufacturing method and an electronic device capable of preventing a ghost. In the image sensor, a plate-like transparent member larger than a sensor chip in size is affixed to a side of a pixel array unit of the sensor chip having the pixel array unit in which pixels that perform photoelectric conversion are arrayed. The present technology can be applied to a case of capturing an image by receiving light, regardless of whether the light is visible light or not.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.16/069,848 filed Jul. 12, 2018, which is a national stage applicationunder 35 U.S.C. 371 and claims the benefit of PCT Application No.PCT/JP2017/000567 having an international filing date of 11 Jan. 2017,which designated the United States, which PCT application claimed thebenefit of Japanese Patent Application No. 2016-010576 filed 22 Jan.2016, the entire disclosures of each of which are incorporated herein byreference.

TECHNICAL FIELD

The present technology relates to an image sensor, a manufacturingmethod and an electronic device, and more particularly, to an imagesensor, a manufacturing method and an electronic device capable ofpreventing a ghost, for example.

BACKGROUND ART

For example, Patent Document 1 describes making a cross section of atransparent member trapezoidal for an image sensor in which a plate-liketransparent member such as glass, is arranged on a light receivingsurface and light is made incident on the surface through thetransparent member.

By making the cross section of the transparent member arranged on thelight receiving surface trapezoidal as described in Patent Document 1,it is possible to prevent a ghost caused by light which is reflected bythe end surface of the transparent member and made incident on the lightreceiving surface.

CITATION LIST Patent Document

-   Patent Document 1: JP 2006-041183 A

SUMMARY OF THE INVENTION Problems to be Solved by the Invention

In a chip size package (CSP) or the like which is a package as an imagesensor, various circuits are reduced in size due to the development ofsemiconductor miniaturization process. Thus, a distance between the endsurface of a sensor chip, which has a pixel array unit in which pixelsthat perform photoelectric conversion are arrayed, and the pixel arrayunit is shortened.

In a case where the distance between the end surface of the sensor chipand the pixel array unit is not so short, the reflected light reflectedby the end surface of the transparent member is incident between the endsurface of the sensor chip and the pixel array unit (outside the pixelarray unit). However, in a case where the distance between the endsurface of the sensor chip and the pixel array unit is short, thereflected light reflected by the end surface of the transparent memberis incident on (the inside of) the pixel array unit, possibly causing aghost.

The present technology has been made in light of such a situation andcan prevent a ghost from occurring.

Solutions to Problems

An image sensor according to the present technology is an image sensorincluding: a sensor chip having a pixel array unit in which pixels thatperform photoelectric conversion are arrayed; and a plate-liketransparent member is affixed to a side of the pixel array unit of thesensor chip and is larger than the sensor chip in size.

In the image sensor according to the present technology, the plate-liketransparent member larger than the sensor chip in size is affixed to thesensor chip having the pixel array unit in which the pixels that performphotoelectric conversion are arrayed.

A manufacturing method according to the present technology is amanufacturing method including: a step of affixing a plate-liketransparent member, to a side of a pixel array unit of a sensor chiphaving the pixel array unit in which pixels that perform photoelectricconversion are arrayed, in which an image sensor, in which the sensorchip and the transparent member larger than the sensor chip in size areaffixed, is manufactured.

In the manufacturing method according to the present technology, theplate-like transparent member is affixed to the side of the pixel arrayunit of the sensor chip having the pixel array unit in which the pixelsthat perform photoelectric conversion are arrayed, and the image sensor,in which the sensor chip and the transparent member larger than thesensor chip in size are affixed, is manufactured.

An electronic device according to the present technology is anelectronic device including: an optical system which collects light; andan image sensor which receives the light and captures an image, in whichthe image sensor includes: a sensor chip having a pixel array unit inwhich pixels that perform photoelectric conversion are arrayed; and aplate-like transparent member which is affixed to a side of the pixelarray unit of the sensor chip and is larger than the sensor chip insize.

In the electronic device according to the present technology, in theimage sensor, the plate-like transparent member larger than the sensorchip in size is affixed to the sensor chip having the pixel array unitin which the pixels that perform photoelectric conversion are arrayed.

Note that the image sensor may be an independent apparatus or aninternal block constituting one apparatus.

Effects of the Invention

According to the present technology, it is possible to prevent a ghost.

Note that the effects described herein are not necessarily limited, andany one of the effects described in the present disclosure may beapplied.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram showing a configuration example of anembodiment of a camera unit to which the present technology is applied.

FIG. 2 is a perspective view showing the outline of a configurationexample of the image sensor 2.

FIG. 3 is a cross-sectional view showing the outline of a configurationexample of an image sensor having a laminate structure of two layers.

FIG. 4 is a cross-sectional view showing a configuration example of asensor chip 40.

FIG. 5 is a cross-sectional view showing a first configuration exampleof the image sensor 2.

FIG. 6 is a diagram illustrating an example of a method for preventing aghost from occurring in a captured image.

FIG. 7 is a cross-sectional view showing a second configuration exampleof the image sensor 2.

FIG. 8 is a plan view of the second configuration example of the imagesensor 2 viewed from the top.

FIG. 9 is a diagram illustrating an example of incident light incidenton the second configuration example of the image sensor 2.

FIG. 10 is a diagram further illustrating the example of the incidentlight incident on the second configuration example of the image sensor2.

FIG. 11 is a cross-sectional view showing a third configuration exampleof the image sensor 2.

FIG. 12 is a cross-sectional view showing a fourth configuration exampleof the image sensor 2.

FIG. 13 is a cross-sectional view showing a fifth configuration exampleof the image sensor 2.

FIG. 14 is a cross-sectional view showing a sixth configuration exampleof the image sensor 2.

FIG. 15 is a cross-sectional view showing a seventh configurationexample of the image sensor 2.

FIG. 16 is a cross-sectional view showing an eighth configurationexample of the image sensor 2.

FIG. 17 is a cross-sectional view showing a ninth configuration exampleof the image sensor 2.

FIG. 18 is a cross-sectional view showing a tenth configuration exampleof the image sensor 2.

FIG. 19 is a diagram illustrating an example of a manufacturing methodof the image sensor 2.

FIG. 20 is a diagram illustrating another example of the manufacturingmethod of the image sensor 2.

FIG. 21 is a diagram showing a usage example of using the image sensor2.

MODE FOR CARRYING OUT THE INVENTION

<Embodiment of Camera Unit to which the Present Technology is Applied>

FIG. 1 is a block diagram showing a configuration example of anembodiment of a camera unit to which the present technology is applied.

Note that the camera unit can capture both a still image and a movingimage.

In FIG. 1, the camera unit has an optical system 1, an image sensor 2, amemory 3, a signal processing unit 4, an output unit 5 and a controlunit 6.

The optical system 1 has, for example, a zoom lens, a focus lens, adiaphragm and the like (all not shown) and make light from the outsideincident on the image sensor 2.

The image sensor 2 is, for example, a complementary metal oxidesemiconductor (CMOS) image sensor with a back surface wiring structure,receives the incident light from the optical system 1, performsphotoelectric conversion and outputs image data corresponding to theincident light from the optical system 1.

The memory 3 temporarily stores the image data outputted by the imagesensor 2.

The signal processing unit 4 performs, for example, processings such asnoise removal, white balance adjustment and the like as signalprocessings using the image data stored in the memory 3 and supplies theimage data to the output unit 5.

The output unit 5 outputs the image data from the signal processing unit4.

That is, the output unit 5 has a display (not shown) constituted by, forexample, liquid crystals or the like, and displays an imagecorresponding to the image data from the signal processing unit 4 as aso-called through image.

Moreover, the output unit 5 has, for example, a driver (not shown) whichdrives a recording medium such as a semiconductor memory, a magneticdisk, an optical disk or the like and records image data from the signalprocessing unit 4 on the recording medium.

Furthermore, the output unit 5 has a communication interface, whichperforms predetermined communication, and transmits the image data fromthe signal processing unit 4 with or without wire.

The control unit 6 controls each block constituting the camera unitaccording to a user operation, an instruction from the outside, or thelike.

In the camera unit configured as described above, the image sensor 2receives the incident light from the optical system 1 and outputs theimage data according to that incident light.

The image data outputted by the image sensor 2 is supplied to the memory3 and stored therein. The image data stored in the memory 3 is subjectedto the signal processings by the signal processing unit 4, and the imagedata obtained as a result is supplied to the output unit 5 andoutputted.

<Configuration Example of Image Sensor 2>

FIG. 2 is a perspective view showing the outline of a configurationexample of the image sensor 2.

The image sensor can be configured with one die (substrate) or can beconfigured by laminating a plurality of dies.

A of FIG. 2 shows a configuration example of the image sensor 2configured with one die.

In A of FIG. 2, the image sensor 2 is configured with a sensor die 10which is one flat die.

In the sensor die 10, a pixel array unit 11, in which a plurality ofpixels (not shown) that perform photoelectric conversion are arrayed inmatrix, and a peripheral circuit are formed. The peripheral circuitincludes a drive circuit to drive the pixels of the pixel array unit 11,and circuits and the like which perform other necessary signalprocessings (including control) to capture an image.

B of FIG. 2 shows a configuration example of the image sensor configuredwith two dies.

In B of FIG. 2, the image sensor 2 has a laminate structure of twolayers in which a sensor die 10 and a logic die 20, which are two flatdies, are laminated.

A pixel array unit 11 is formed in the sensor die 10, and a peripheralcircuit 12 is formed in the logic die 20.

C of FIG. 2C shows a configuration example of the image sensorconfigured with three dies.

In C of FIG. 2, the image sensor 2 has a laminate structure of threelayers in which a sensor die 10, a logic die 20 and a memory die 30,which are three flat dies, are laminated.

A pixel array unit 11 is formed in the sensor die 10, and a peripheralcircuit 12 is formed in the logic die 20. A memory 13 is formed in thememory die 30.

In the case of configuring the image sensor 2 with the laminatestructure as shown in B and C of FIG. 2, a peripheral circuit is notrequired to be included in the sensor die 10 so that the sizes (areas)of the sensor die 10 and accordingly, the image sensor 2 can be reduced.

Moreover, in the case of configuring the image sensor 2 with thelaminate structure, it is possible to shorten wires between the pixelarray unit 11 and the peripheral circuit 12, reduce the time constantdue to the capacitance, and achieve high speed.

Furthermore, in the case of configuring the image sensor 2 with thelaminate structure, various image processings can be possible within theimage sensor 2 by providing the memory die 30 in which the memory 13 isformed as in C of FIG. 2, and an image with added value and informationregarding the image can be outputted.

Hereinafter, for example, the image sensor 2 having the laminatestructure of two layers in which the sensor die 10 and the logic die 20are laminated as in B of FIG. 2 will be described as an example.

Note that, in addition to the image sensor 2 having the laminatestructure of two layers, the present technology can be applied to, forexample, the image sensor 2 not having a laminate structure as shown inA of FIG. 2, the image sensor 2 having the laminate structure of threelayers as shown in C of FIG. 2, an image sensor having a laminatestructure of four or more layers, and an image sensor with any otherconfigurations.

FIG. 3 is a cross-sectional view showing the outline of a configurationexample of an image sensor having a laminate structure of two layers.

In FIG. 3, of the sensor die 10 and the logic die 20, the sensor die 10and the logic die 20 are affixed, in which the sensor die 10 is placedas an upper side (the side on which the light received by the imagesensor is incident), so as to configure a sensor chip 40 with a laminatestructure of two layers.

Moreover, in FIG. 3, the image sensor of (wafer level) chip size package(CSP) is configured by affixing a protective glass 41 with the same sizeas the sensor chip 40 on the upper side (sensor die 10 side) of thesensor chip 40 and forming (back surface) electrodes 42 under (logic die20 side) the sensor chip 40.

Since the electrodes 42 are formed under the sensor chip 40 in FIG. 3 asdescribed above, the image sensor can be mounted by flip chip.

FIG. 4 is a cross-sectional view showing a configuration example of thesensor chip 40.

That is, FIG. 4 is a partial enlarged view of the cross section of thesensor chip 40.

In the logic die 20, a multilayer wiring layer 122 is formed on theupper side (sensor die 10 side) of a semiconductor substrate 121(hereinafter referred to as a silicon substrate 121) including, forexample, silicon (Si). A part of the peripheral circuit 12 in FIG. 2 isconfigured by this multilayer wiring layer 122.

The multilayer wiring layer 122 is configured with a plurality of wiringlayers 123, which include an uppermost wiring layer closest to thesensor die 10, an intermediate wiring layer, a lowermost wiring layerclosest to the silicon substrate 121 and the like, and interlayerinsulating films 124 formed between each of the wiring layers 123.

The plurality of wiring layers 123 are formed by using, for example,copper (Cu), aluminum (Al), tungsten (W), or the like, and theinterlayer insulating films 124 are formed by, for example, siliconoxide films, silicon nitride films, or the like. The plurality of wiringlayers 123 and the interlayer insulating films 124 may be each made byincluding the same material for all the layers, or two or more materialsmay be used separately depending on the layers.

The plurality of wiring layers 123 are electrically connected to theelectrodes 42 (FIG. 3) through the silicon substrate 121.

In the sensor die 10, a multilayer wiring layer 102 is formed on thelower side (logic die 20 side) of a semiconductor substrate 101(hereinafter referred to as a silicon substrate 101) including silicon(Si). This multilayer wiring layer 102 constitutes another part of theperipheral circuit 12 such as a readout circuit (not shown) which readsout signals from the pixels and the like.

The multilayer wiring layer 102 is configured with a plurality of wiringlayers 103, which include an uppermost wiring layer closest to thesilicon substrate 101, an intermediate wiring layer, a lowermost wiringlayer closest to the logic die 20 and the like, and interlayerinsulating films 104 formed between each of the wiring layers 103.

For the material used as the plurality of wiring layers 103 and theinterlayer insulating films 104, the same material as the wiring layers123 and the interlayer insulating films 124 described above can beadopted. Moreover, the plurality of wiring layers 103 and the interlayerinsulating films 104 are similar to the wiring layers 123 and theinterlayer insulating films 124 described above in that the wiringlayers 103 and the interlayer insulating films 104 may be made byincluding one material or two or more materials separately.

Note that the multilayer wiring layer 102 of the sensor die 10 isconfigured with three wiring layers 103 and the multilayer wiring layer122 of the logic die 20 is configured with four wiring layers 123 in theexample in FIG. 4, but the total number of wiring layers is not limitedthis, and the wiring layers can be formed by any number of layers.

In the silicon substrate 101, photo diodes (PD) 110 serving as thepixels are formed by PN junction.

An insulating film (planarizing film) 108 is formed on the upper surfaceof the silicon substrate 101, and on chip lenses (OCL) 111 and colorfilters (CF) 112 are formed at portions of the upper part of theinsulating film 108 corresponding to the PDs 51.

At predetermined positions of a portion of the silicon substrate 101where the OCLs 111 and the CFs 112 are not formed in the insulating film108, a silicon through electrode 109, which is connected to the wiringlayer 102 of the sensor die 10, and a chip through electrode 105, whichis connected to the wiring layer 122 of the logic die 20, are formed.

The chip through electrode 105 and the silicon through electrode 109 areconnected by a connecting wire 106 formed on the upper surface side ofthe silicon substrate 101. Moreover, insulating films 107 are formedbetween each of the silicon through electrode 109 and the chip throughelectrode 105 and the silicon substrate 101.

The sensor chip 40 has a laminate structure in which the multilayerwiring layer 122 side of the logic die 20 and the multilayer wiringlayer 102 side of the sensor die 10 are affixed. In FIG. 4, the affixingsurfaces of the multilayer wiring layer 122 of the logic die 20 and themultilayer wiring layer 102 of the sensor die 10 are indicated by abroken line.

<First Configuration Example of Image Sensor 2>

FIG. 5 is a cross-sectional view showing a first configuration exampleof the image sensor 2.

Note that portions in the drawing corresponding to those in FIG. 3 aredenoted by the same reference signs, and the descriptions thereof willbe omitted as appropriate hereinafter.

In FIG. 5, the image sensor 2 has a sensor chip 40 with a laminatestructure of two layers of a sensor die 10 and a logic die 20, aprotective glass 41 and electrodes 42.

Therefore, the image sensor 2 in FIG. 5 is configured similarly to theimage sensor in FIG. 3.

Note that the protective glass 41 is affixed to the sensor die 10 of thesensor chip 40 by using a transparent adhesive 43. Although FIG. 5 showsthe adhesive 43, the illustration of the adhesive 43 is omitted in FIG.3.

Herein, the distance between the end surface of the sensor chip 40 andthe pixel array unit 11 is denoted by A, and the thickness of theprotective glass 41 (and the adhesive 43) is denoted by B.

Further, in a case where incident light with an angle, that is, incidentlight incident on the protective glass 41 from a direction tilted fromthe normal direction of the plane as the pixel array unit 11 isreflected by the end surface of the protective glass 41 and is incidenton the sensor chip 40, the distance between the position, where thatincident light is incident on the sensor chip 40, and the end surface ofthe sensor chip 40 is denoted by C.

In a case where the distance A is sufficiently longer than the thicknessB of the protective glass 41, the relationship between the distances Aand C is A>C. The incident light reflected by the end surface of theprotective glass 41 is, therefore, not incident on (the inside of) thepixel array unit 11, and a ghost does not occur in the image obtained bythe image sensor 2.

Incidentally, due to the development of the semiconductorminiaturization process, the distance A is short.

In the case of configuring the image sensor 2 by forming the peripheralcircuit 12 in the logic die 20 different from the sensor die 10 in whichthe pixel array unit 11 is formed and laminating the sensor die 10 andthe logic die 20 as shown in FIG. 2, the distance A is further shorter.

When the distance A is short and the relationship between the distancesA and C is A<C as described above, the incident light reflected by theend surface of the protective glass 41 is incident on the pixel arrayunit 11, and a ghost occurs in the image (hereinafter referred to as thecapture image) obtained by the image sensor 2.

FIG. 6 is a diagram illustrating an example of a method for preventing aghost from occurring in the captured image.

That is, FIG. 6 shows a cross section of the image sensor 2 in a statein which the protective glass 41 in FIG. 5 is thinned.

As described with FIG. 5, in the case where the distance A issufficiently longer than the thickness B of the protective glass 41, therelationship between the distances A and C is A>C so that a ghost doesnot occur.

Thereupon, as shown in FIG. 6, there is a method for preventing a ghostfrom occurring by shortening (thinning) the thickness B of theprotective glass 41 according to the distance A, which is short as aresult of the miniaturization, to maintain the relationship between thedistances A and C to A>C.

That is, by shortening the thickness B of the protective glass 41, therelationship between the distances A and C does not become A<C even ifthe distance A is shortened, and the occurrence of a ghost can beprevented.

However, when the thickness B of the protective glass 41 is shortened,the mechanical rigidity of the image sensor 2 of the CSP is lowered, andwarps as indicated by the arrow W in FIG. 6 are prone to occur in theimage sensor 2.

When the warps occur in the image sensor 2, the distances between a lens(not shown), which collects light incident on the image sensor 2, andthe pixels in the central portion and the pixels in the peripheralportion of the pixel array unit 11 are made different by the degrees ofthe warps, and the focusing may be varied in (the pixels) of the entirepixel array unit 11 in some cases.

Now, an F value of the lens, a size (horizontal and vertical lengths) ofone pixel of the pixel array unit 11, and a focal depth of the lens aredenoted by F, a and b, respectively. Moreover, when the diameter of thepermissible circle of confusion is set to a size of (less than) twopixels, the focal depth b of the lens is expressed by the expressionb=F×2×a.

For example, in a case where F=2.0 and a=1.2 μm, the focal depth b ofthe lens is 2×2×1.2=4.8 μm. When the position of the pixel in theoptical axis direction is deviated by 4.8 μm or more due to the warps ofthe image sensor 2, the focusing varies, and a blur occurs in thecaptured image.

Thereupon, hereinafter, the image sensor 2 which prevents a ghost fromoccurring in the captured image, which is the image sensor 2 which canprevent the warps of the image sensor 2 due to the lowering of themechanical rigidity from occurring as well as a blur from occurring inthe captured image, will be described.

<Second Configuration Example of Image Sensor 2>

FIG. 7 is a cross-sectional view showing a second configuration exampleof the image sensor 2.

Note that portions in the drawing corresponding to those in FIG. 5 aredenoted by the same reference signs, and the descriptions thereof willbe omitted as appropriate hereinafter.

In FIG. 7, the image sensor 2 has a sensor chip 40 with a laminatestructure of two layers of a sensor die 10 and a logic die 20,electrodes 42 and a protective glass 201. Moreover, in the image sensor2 in FIG. 7, the protective glass 201 is affixed to (the sensor die 10of) the sensor chip 40 by an adhesive 43.

Therefore, the image sensor 2 in FIG. 7 is common to the case in FIG. 5in that the image sensor 2 has the sensor chip 40 and the electrodes 42.

However, the image sensor 2 in FIG. 7 is different from the case in FIG.5 in that the protective glass 201 is provided instead of the protectiveglass 41.

The protective glass 201 is a plate-like transparent member larger thanthe sensor chip 40 in size (area of the surface on which the light isincident on the image sensor 2) and is affixed to the sensor chip 40 bythe adhesive 43.

Note that the protective glass 201 with the large size can be directlyaffixed to the sensor chip 40 or can be indirectly affixed to the sensorchip 40. That is, the protective glass 201 can be affixed to theprotective glass 41 of the image sensor 2 with the thin protective glass41 as shown in FIG. 6.

As described above, there is no need to directly affix the protectiveglass 201 to the sensor chip 40, and some transparent member may bepresent between the protective glass 201 and the sensor chip 40. Theconfiguration examples of the image sensor 2 described hereinafter arealso similar in this respect.

Moreover, in the description hereinafter, for convenience ofexplanation, the left and right and the up and down of the image sensor2 are each symmetrical.

FIG. 8 is a plan view of the second configuration example of the imagesensor 2 in FIG. 7 viewed from the top.

In FIG. 8, the protective glass 201 is larger than the sensor chip 40 insize.

That is, a horizontal length H1 and a vertical length V1 of theprotective glass 201 are longer than a horizontal length H2 and avertical length V2 of the sensor chip 40, respectively.

Therefore, the end surface of the protective glass 201 is positionedoutside the end surface of the sensor chip 40 as well as the end portionof the pixel array unit 11.

Note that a distance A between the end surface of the sensor chip 40 andthe pixel array unit 11 is short in FIG. 8 (and FIG. 7).

FIG. 9 is a diagram illustrating an example of incident light incidenton the second configuration example of the image sensor 2 in FIGS. 7 and8.

In FIG. 9, incident lights IL0, IL1 and IL2 are lights all with anglesand lights not incident on the pixel array unit 11 as long as the lightsgo straight.

In FIG. 9, the incident light IL0 is incident on the protective glass201 and is reflected by an end surface E11 of that protective glass 201.

The incident light IL0 reflected by the end surface of the protectiveglass 201 is directed to the inside of the image sensor 2. However,since the end surface E11 of the protective glass 201 is positionedoutside an end surface E12 of the sensor chip 40, the incident light IL0arrives at a position of the lower surface of the protective glass 201projecting from the sensor chip 40.

That is, since the protective glass 201 is larger than the sensor chip40 in size, the incident light IL0, which is reflected by the endsurface E11 of the protective glass 201 and directed to the inside ofthe image sensor 2, does not reach the sensor chip 40 nor the pixelarray unit 11.

Therefore, it is possible to prevent a ghost from occurring in thecaptured image due to the incident light reflected by the end surfaceE11 of the protective glass 201 and incident on the pixel array unit 11.

For the size of the protective glass 201 larger than the size of thesensor chip 40, for example, any size can be adopted as long as theincident light with the maximum angle among the incident lights assumedto be incident on the protective glass 201 is not incident on the pixelarray unit 11 even when the incident light is reflected by the endsurface E11 of the protective glass 201.

Herein, “the incident light with the maximum angle” described abovemeans the incident light with the maximum inclination from the normaldirection of the plane as the pixel array unit 11.

In FIG. 9, the incident light IL1 is incident on the protective glass201, passes through the lower surface of the protective glass 201, andis reflected by an end portion E13 of the adhesive 43 toward the insideof the image sensor 2.

Since the thickness of the adhesive 43 is extremely thin, even if adistance A between the end surface E12 of the sensor chip 40 and thepixel array unit 11 is short, the incident light IL1 reflected by theend portion E13 of the adhesive 43 does not reach the pixel array unit11 and arrives between the end surface E12 of the sensor chip 40 and thepixel array unit 11.

Therefore, a ghost due to the incident light IL1 reflected by the endportion E13 of the adhesive 43 does not occur.

In FIG. 9, the incident light IL2 is incident on the protective glass201 and is reflected by the lower surface of the protective glass 201toward the outside (the end surface E11 of the protective glass 201) ofthe image sensor 2.

The incident light IL2 reflected by the lower surface of the protectiveglass 201 may be possibly reflected by the end surface E11 of theprotective glass 201 thereafter, but does not reach the pixel array unit11 unless the incident light IL2 is light with high intensity (lightfrom a high luminance light source).

In this case, a ghost due to the incident light IL1 reflected by thelower surface of the protective glass 201 does not occur.

Note that, for the thickness B (which may include the adhesive 43) ofthe protective glass 201, a thickness satisfying the mechanical rigidityrequired for the image sensor 2 is adopted. As the thickness B of theprotective glass 201, for example, 200 μm or more can be adopted.

FIG. 10 is a diagram further illustrating the example of the incidentlight incident on the second configuration example of the image sensor2.

As described with FIG. 9, the incident light IL2 reflected by the lowersurface of the protective glass 201 may be possibly reflected by the endsurface E11 of the protective glass 201 thereafter, but does not reachthe pixel array unit 11 unless the incident light IL2 is light with highintensity.

However, in a case where the incident light IL2 is light with highintensity, after reflected by the lower surface of the protective glass201, the incident light IL2 is further reflected by the end surface E11of the protective glass 201 and the like and may possibly arrive at thepixel array unit 11.

In FIG. 10, the incident light IL2 reflected by the lower surface of theprotective glass 201 is reflected by the end surface E11 of theprotective glass 201 and the upper surface of the protective glass 201thereafter and arrives at the pixel array unit 11. In this case, a ghostoccurs in the captured image.

<Third Configuration Example of Image Sensor 2>

FIG. 11 is a cross-sectional view showing a third configuration exampleof the image sensor 2.

That is, as described with FIG. 10, FIG. 11 shows the image sensor 2which prevents a ghost from occurring due to the incident light incidenton the pixel array unit 11 via multiple reflections inside theprotective glass 201.

Note that portions in the drawing corresponding to those in FIG. 7 aredenoted by the same reference signs, and the descriptions thereof willbe omitted as appropriate hereinafter.

In FIG. 11, the image sensor 2 has a sensor chip 40 with a laminatestructure of two layers of a sensor die 10 and a logic die 20,electrodes 42 and a protective glass 211. Moreover, in the image sensor2 in FIG. 11, the protective glass 211 is affixed to the sensor chip 40by an adhesive 43.

Therefore, the image sensor 2 in FIG. 11 is common to the case in FIG. 7in that the image sensor 2 has the sensor chip 40 and the electrodes 42.

However, the image sensor 2 in FIG. 11 is different from the case inFIG. 7 in that the protective glass 211 is provided instead of theprotective glass 201.

The protective glass 211 is common to the protective glass 201 in thatthe protective glass 211 is a plate-like transparent member larger thanthe sensor chip 40 in size.

However, the protective glass 201 and the protective glass 211 aredifferent in that the cross-sectional shape of the protective glass 201is rectangular whereas the cross-sectional shape of the protective glass211 is trapezoidal.

In FIG. 11, the protective glass 211 has an isosceles trapezoidalcross-sectional shape in which the inner angles of both ends of thebases (upper base and lower base) are equal.

Moreover, in FIG. 11, the size of the upper surface of the protectiveglass 211 is larger than the size of the lower surface. Accordingly, thetrapezoid as the cross-sectional shape of the protective glass 211 is atrapezoid in which the lower base is longer than the upper base.

Note that the trapezoid of the cross-sectional shape of the protectiveglass 211 may be not an isosceles trapezoid or may be a trapezoid inwhich the upper base is longer than the lower base.

Since the cross-sectional shape of the protective glass 211 istrapezoidal, end surfaces E2 are tapered. Therefore, incident light IL2reflected by the lower surface of the protective glass 211 toward theoutside of the image sensor 2 may be possibly reflected by an endsurface E2 of the protective glass 211 thereafter. However, the incidentlight IL2 is reflected by the tapered end surface E2 toward the outsideof the image sensor 2.

Therefore, it is possible to suppress the occurrence of a ghost due tothe incident light (secondary light, tertiary light and the like)incident on the pixel array unit 11 via multiple reflections inside theprotective glass 211.

Note that any cross-sectional shape can be adopted for thecross-sectional shape of the protective glass 211 besides a trapezoid aslong as the incident light reflected by the lower surface of theprotective glass 211 toward the outside of the image sensor 2 isreflected toward the outside of the image sensor 2. That is, for thecross-sectional shape of the protective glass 211, a tapered shape ofthe end surfaces E2 of the protective glass 211, such as aparallelogram, can be adopted besides a trapezoid, for example.

<Fourth Configuration Example of Image Sensor 2>

FIG. 12 is a cross-sectional view showing a fourth configuration exampleof the image sensor 2.

Note that portions in the drawing corresponding to those in FIG. 11 aredenoted by the same reference signs, and the descriptions thereof willbe omitted as appropriate hereinafter.

In FIG. 12, the image sensor 2 has a sensor chip 40 with a laminatestructure of two layers of a sensor die 10 and a logic die 20,electrodes 42 and a protective glass 211. Moreover, in the image sensor2 in FIG. 12, the protective glass 211 is affixed to the sensor chip 40by an adhesive 43.

Therefore, the image sensor 2 in FIG. 11 is common to the case in FIG.11 in that the image sensor 2 has the sensor chip 40, the electrodes 42and the protective glass 211.

However, the image sensor 2 in FIG. 12 is different from the case inFIG. 11 in that infrared cut filter (IRCF) films 221 are attached to theupper surface and the lower surface of the protective glass 211.

Herein, in each configuration example of the image sensor 2 describedhereinafter, as a protective glass affixed to the sensor chip 40, aprotective glass with a rectangular cross-sectional shape like theprotective glass 201 or a protective glass with a trapezoidalcross-sectional shape like the protective glass 211 is shown asappropriate. However, in each configuration example, any one of therectangular protective glass and the protective glass with thetrapezoidal cross-sectional shape can be adopted as far as possible.

In the image sensor 2 in FIG. 12, the IRCF films 221 are, for example,reflection type IRCFs and can be attached to the upper surface and thelower surface of the protective glass 211 by depositing several tens oflayers.

The image sensor 2 in FIG. 12 is an image sensor integrated with theIRCFs, and a thin camera unit (module) can be configured by adding theoptical system 1 to such an image sensor 2.

That is, as a method for preventing infrared rays from being incident onthe image sensor 2, for example, there is a method for providing an IRCFbetween the upper side of the image sensor 2, that is, the opticalsystem 1 (FIG. 1) and the image sensor 2 not having the IRCF film 221.

In the case where the IRCF is provided between the optical system 1 andthe image sensor 2 as described above, gaps are generated between theoptical system 1 and the IRCF and between the IRCF and the image sensor2, and the thickness of the camera unit becomes longer accordingly.Moreover, according to the gap between the IRCF and the image sensor 2,a lens with a long back focal length is required as a lens constitutingthe optical system 1, which hinders the thinning.

On the other hand, in the image sensor 2 in which the IRCF films 221 areattached to the protective glass 211 as shown in FIG. 12, there is nogap between the IRCF and the image sensor 2 so that the thickness of thecamera unit can be shortened accordingly.

Note that the IRCF films 221 can be attached to any one of the uppersurface and the lower surface of the protective glass 211, besides beingattached to both of the surfaces.

Herein, the protective glass 211 to which the IRCF films 221 areattached can be manufactured by, for example, depositing several tens oflayers forming the IRCF films 221. However, when such deposition isperformed, a defective product with a pinhole defect and the like isprone to occur.

Therefore, in a case of manufacturing the image sensor 2 by affixing thesensor chip 40 and the protective glass 211 to which the IRCF films 221are attached at the wafer level, the yield of the entire image sensor 2may be deteriorated due to the pinhole defect which is prone to occur atthe time of deposition to form the IRCF films 221.

Thereupon, the sensor chip 40 and the protective glass 211 to which theIRCF films 221 are attached are affixed not at the wafer level. Thesensor chip 40 and the protective glass 211 to which the IRCF films 221are attached are both singulated at the wafer level, and the only goodpieces selected from among the singulated pieces of both the sensor chip40 and the protective glass 211 can be affixed.

By affixing the sensor chip 40 and the protective glass 211 to which theIRCF films 221 are attached after selecting only good pieces of thesingulated of the pieces as described above, it is possible to preventthe deterioration of the yield and suppress the manufacturing costs.

Note that the IRCF films 221 can be applied to, for example, theprotective glass 201 (FIG. 7) with a rectangular cross-sectional shapeand the like besides the protective glass 211 with the trapezoidalcross-sectional shape.

<Fifth Configuration Example of Image Sensor 2>

FIG. 13 is a cross-sectional view showing a fifth configuration exampleof the image sensor 2.

Note that portions in the drawing corresponding to those in FIG. 11 aredenoted by the same reference signs, and the descriptions thereof willbe omitted as appropriate hereinafter.

In FIG. 13, the image sensor 2 has a sensor chip 40 with a laminatestructure of two layers of a sensor die 10 and a logic die 20,electrodes 42 and a protective glass 231. Moreover, in the image sensor2 in FIG. 13, the protective glass 231 is affixed to the sensor chip 40by an adhesive 43.

Therefore, the image sensor 2 in FIG. 11 is common to the case in FIG.11 in that the image sensor 2 has the sensor chip 40 and the electrodes42.

However, the image sensor 2 in FIG. 13 is different from the case inFIG. 11 in that the protective glass 231 is provided instead of theprotective glass 211.

The protective glass 231 is common to the protective glass 211 in thatthe protective glass 231 is a plate-like transparent member larger thanthe sensor chip 40 in size and has a trapezoidal cross-sectional shape.

However, the protective glass 231 is different from the protective glass211 which can adopt any transparent member, in that the protective glass231 is constituted by a transparent member which absorbs infrared rays,such as a blue plate glass, for example.

Since the protective glass 231 absorbs infrared rays, the protectiveglass 231 functions as an IRCF. Therefore, like the case in FIG. 12, theimage sensor 2 in FIG. 13 is also an image sensor integrated with theIRCF, and, like the case in FIG. 12, a thin camera unit can be alsoconfigured by adding the optical system 1 to such an image sensor 2.

Herein, defective products are prone to occur in the manufacturingprocess of the protective glass 231 which absorbs infrared rays, likethe protective glass 211 to which IRCF films 221 are attached in FIG.12.

Therefore, like the case in FIG. 12, the sensor chip 40 and theprotective glass 231 are affixed not at the wafer level. The sensor chip40 and the protective glass 231 are both singulated at the wafer level,and only good pieces selected from among the singulated pieces of boththe sensor chip 40 and the protective glass 231 are affixed. Thus, it ispossible to prevent the deterioration of the yield and suppress themanufacturing costs.

In addition, coefficients of thermal expansion (CTE) are greatlydifferent between (the material of) the transparent member, whichconstitutes the protective glass 231 as the IRCF and absorbs infraredrays, and silicon (Si), which constitutes the sensor chip 40.

Therefore, in a case where the sensor chip 40 and the protective glass231 are affixed at the wafer level, when back surface wires are formedto connect to the sensor chip 40 to the electrodes 42 thereafter and thesensor chip 40 and the protective glass 231 become very hot, forexample, during chemical vapor deposition (CVD) to form the insulatingfilms, a large warp may occur in the entire wafer and the manufacturingof the image sensor 2 may become possibly difficult.

By affixing the sensor chip 40 and the protective glass 231 after thesensor chip 40 and the protective glass 231 are singulated, it ispossible to prevent the difficulty of the manufacturing of the imagesensor 2 as described above.

Note that the transparent member which absorbs infrared rays can beapplied to, for example, a protective glass with a rectangularcross-sectional shape, like the protective glass 201 (FIG. 7), and thelike besides a protective glass with a trapezoidal cross-sectionalshape, like the protective glass 231.

<Sixth Configuration Example of Image Sensor 2>

FIG. 14 is a cross-sectional view showing a sixth configuration exampleof the image sensor 2.

Note that portions in the drawing corresponding to those in FIG. 13 aredenoted by the same reference signs, and the descriptions thereof willbe omitted as appropriate hereinafter.

In FIG. 14, the image sensor 2 has a sensor chip 40 with a laminatestructure of two layers of a sensor die 10 and a logic die 20,electrodes 42 and a protective glass 231. Moreover, in the image sensor2 in FIG. 14, the protective glass 231 is affixed to the sensor chip 40by an adhesive 43.

Therefore, the image sensor 2 in FIG. 14 is common to the case in FIG.13 in that the image sensor 2 has the sensor chip 40, the electrodes 42and the protective glass 231.

However, the image sensor 2 in FIG. 14 is different from the case inFIG. 13 in that light shielding films 241 are formed at the peripheralportions of both the upper surface and the lower surface of theprotective glass 231.

The light shielding films 241 are formed at the peripheral portions ofboth the upper surface and the lower surface of the protective glass 231so as not to block the light directly incident on a pixel array unit 11,that it, light which is not reflected inside the protective glass 231,but penetrates the protective glass 231 and is incident on the pixelarray unit 11.

In the case where the light shielding films 241 are formed at theperipheral portions of both the upper surface and the lower surface ofthe protective glass 231 as described above, incident light causinglight (secondary light, tertiary light and the like) via multiplereflections inside the protective glass 231 is blocked by the lightshielding films 241 as described with FIG. 11. As a result, it ispossible to further prevent a ghost from occurring.

Note that the light shielding films 241 can be formed on only one of theupper surface and the lower surface of the protective glass 231, besidesbeing formed on both the upper surface and the lower surface of theprotective glass 231.

Moreover, the light shielding films 241 can be applied to, for example,a protective glass with a rectangular cross-sectional shape, like theprotective glass 201 (FIG. 7), and the like besides a protective glasswith a trapezoidal cross-sectional shape, like the protective glass 231.

Furthermore, the light shielding films 241 can be applied to theprotective glass 211 to which the IRCF films 221 (FIG. 12) are attached.

<Seventh Configuration Example of Image Sensor 2>

FIG. 15 is a cross-sectional view showing a seventh configurationexample of the image sensor 2.

Note that portions in the drawing corresponding to those in FIG. 11 aredenoted by the same reference signs, and the descriptions thereof willbe omitted as appropriate hereinafter.

In FIG. 15, the image sensor 2 has a sensor chip 40 with a laminatestructure of two layers of a sensor die 10 and a logic die 20, aprotective glass 211 and wires 252. Moreover, in the image sensor 2 inFIG. 15, the protective glass 211 is affixed to the sensor chip 40 by anadhesive 43.

Therefore, the image sensor 2 in FIG. 15 is common to the case in FIG.11 in that the image sensor 2 has the sensor chip 40 and the protectiveglass 211.

However, the image sensor 2 in FIG. 15 is different from the case inFIG. 11 in that the wires 252 are provided instead of the electrodes 42.

In the image sensor 2 in FIG. 11, the electrodes 42 are formed under thesensor chip 40, and the image sensor 2 can be mounted by flip chip.

On the other hand, the electrodes 42 are not formed in the image sensor2 in FIG. 15, and the image sensor 2 is mounted by wire bonding.

That is, the sensor chip 40 and a substrate 251 constituting the packageof the image sensor 2 are electrically connected by the wires 252including aluminum, copper, or the like.

Like the image sensor 2 in FIG. 11 executed by flip chip, it is possibleto prevent a ghost from occurring also in the image sensor 2 mounted bywire bonding.

Note that, instead of the protective glass 211, for example, theprotective glass 201 in FIG. 7, the protective glass 211 to which theIRCF films 221 are attached in FIG. 12, the protective glass 231 in FIG.13, the protective glass 231 on which the light shielding films 241 areformed in FIG. 14, or any other combination of the protective glasses ofthe configuration examples of the image sensor 2 described above can beadopted in the image sensor 2 mounted by wire boding in FIG. 15.

Moreover, in the image sensor 2 mounted by wire bonding in FIG. 15, thewires 252 connected to the sensor chip 40 are drawn out to positionsslightly higher than the upper surface of the sensor chip 40 from thesensor chip 40 and connected to the substrate 251 as shown in FIG. 15.

Since the wires 252 are drawn out to the positions slightly higher thanthe upper surface of the sensor chip 40 from the sensor chip 40 in theimage sensor 2 mounted by wire bonding as described above, the wires 252slightly protrude from the upper surface of the sensor chip 40.

The image sensor 2 mounted by wire bonding needs a gap at the upper sideof the sensor chip 40, that is, between the sensor chip 40 and theprotective glass 211 so as not to hinder the wires 252 from protrudingfrom the upper surface of the sensor chip 40.

Thereupon, in the image sensor 2 mounted by wire bonding, the thicknessof the adhesive 43 which affixes the sensor chip 40 and the protectiveglass 211 is adjusted so that protrusion of the wires 252 can besecured.

Alternatively, a step is provided at the lower surface of the protectiveglass 211 so that the protrusion of the wires 252 can be secured.

By adjusting the thickness of the adhesive 43 or by providing the stepat the protective glass 211 as described above, it is possible to securethe protrusion of the wires 252 and affix the protective glass 211larger than the sensor chip 40 in size to the sensor chip 40. Therefore,it is possible to prevent a ghost from occurring in the image sensor 2mounted by wire bonding.

Note that the surroundings of the wires 252 are filled with the adhesive43 in the image sensor 2 mounted by wire bonding in a case where thethickness of the adhesive 43, which affixes the sensor chip 40 and theprotective glass 211, is adjusted so that the protrusion of the wires252 can be secured.

In this case, incident light which have passed through the protectiveglass 211 does not directly hit the wires 252. That is, since the lighthitting the wires 252 needs to penetrate the adhesive 43 used to fillthe surroundings of the wires 252, the light is not the incident lightitself passed through the protective glass 211 but the light that haspassed through at least the adhesive 43.

Since the incident light passed through the protective glass 211 do notdirectly hit the wires 252 in the image sensor 2 mounted by wire boingas described above, it is possible to suppress a ghost occurring due tothe light reflected by the wires 252 as compared with a case where theincident light passed through the protective glass 211 directly hits thewires 252.

Moreover, since the wires 252 are drawn out from the peripheral portionsof the sensor chip 40 in FIG. 15, it is possible to prevent a ghostoccurring due to the light reflected by the wires 252 by forming thelight shielding films 241 at the peripheral portion of the protectiveglass 211 to block the incidence of the light on the wires 252 as shownin FIG. 14.

<Eighth Configuration Example of Image Sensor 2>

FIG. 16 is a cross-sectional view showing an eighth configurationexample of the image sensor 2.

Note that portions in the drawing corresponding to those in FIG. 7 aredenoted by the same reference signs, and the descriptions thereof willbe omitted as appropriate hereinafter.

In FIG. 16, the image sensor 2 has a sensor chip 40 with a laminatestructure of two layers of a sensor die 10 and a logic die 20,electrodes 42 and a protective glass 201. Moreover, in the image sensor2 in FIG. 16, the protective glass 201 is affixed to the sensor chip 40by an adhesive 43.

Therefore, the image sensor 2 in FIG. 16 is common to the case in FIG.11 in that the image sensor 2 has the sensor chip 40, the electrodes 42and the protective glass 201.

However, the surroundings of the sensor chip 40 are filled with a resin261 which seals the surroundings of the sensor chip 40 in the imagesensor 2 in FIG. 16, which is different from the case in FIG. 7 in whichthe resin 261 is not used to fill.

In FIG. 16, the resin 261 is a light shielding resin having a lightshielding property and is used to fill between positions of end surfacesE11 of the protective glass 201 and positions of end surfaces E12 of thesensor chip 40 in the horizontal direction. Moreover, the resin 261 isused to fill between the position of the lower surface of the protectiveglass 201 and the position of the lower surface of the sensor chip 40 inthe vertical direction.

By filling with the resin 261, it is possible to protect a portion ofthe protective glass 201 larger than the sensor chip 40 in sizeprojecting from the sensor chip 40 viewed from the top, and the imagesensor 2 can be easily handled.

That is, for example, the chipping of the end portion of the protectiveglass 201 (e.g., chipping of the corner portion) is suppressed, and thehandling of the image sensor 2 at the time of mounting the opticalsystem 1 on the image sensor 2 can be facilitated.

<Ninth Configuration Example of Image Sensor 2>

FIG. 17 is a cross-sectional view showing a ninth configuration exampleof the image sensor 2.

Note that portions in the drawing corresponding to those in FIG. 11 or16 are denoted by the same reference signs, and the descriptions thereofwill be omitted as appropriate hereinafter.

In FIG. 17, the image sensor 2 has a sensor chip 40 with a laminatestructure of two layers of a sensor die 10 and a logic die 20,electrodes 42 and a protective glass 211. Moreover, in the image sensor2 in FIG. 17, the protective glass 211 is affixed to the sensor chip 40by an adhesive 43.

Therefore, the image sensor 2 in FIG. 17 is common to the case in FIG.11 in that the image sensor 2 has the sensor chip 40, the electrodes 42and the protective glass 211.

However, the surroundings of the sensor chip 40 are filled with a resin261 as described with FIG. 16 in the image sensor 2 in FIG. 17, which isdifferent from the case in FIG. 11 in which the resin 261 is not used tofill.

Like the case in FIG. 16, by filling with the resin 261 also in theimage sensor 2 in FIG. 17, it is possible to protect a portion of theprotective glass 211 larger than the sensor chip 40 in size projectingfrom the sensor chip 40, and the image sensor 2 can be easily handled.

<Tenth Configuration Example of Image Sensor 2>

FIG. 18 is a cross-sectional view showing a tenth configuration exampleof the image sensor 2.

Note that portions in the drawing corresponding to those in FIG. 15 or16 are denoted by the same reference signs, and the descriptions thereofwill be omitted as appropriate hereinafter.

In FIG. 18, the image sensor 2 has a sensor chip 40 with a laminatestructure of two layers of a sensor die 10 and a logic die 20, aprotective glass 211 and wires 252. Moreover, in the image sensor 2 inFIG. 18, the protective glass 211 is affixed to the sensor chip 40 by anadhesive 43, and the wires 252 electrically connect the sensor chip 40and a substrate 251.

Therefore, the image sensor 2 in FIG. 18 is common to the case in FIG.15 in that the image sensor 2 has the sensor chip 40, the protectiveglass 211 and the wires 252.

However, the surroundings of the sensor chip 40 are filled with a resin261 as described with FIG. 16 in the image sensor 2 in FIG. 18, which isdifferent from the case in FIG. 15 in which the resin 261 is not used tofill.

Like the case in FIG. 16, by filling with the resin 261 also in theimage sensor 2 in FIG. 18, it is possible to protect a portion of theprotective glass 211 larger than the sensor chip 40 in size projectingfrom the sensor chip 40, and the image sensor 2 can be easily handled.

Note that the image sensors 2 in FIGS. 16 to 18 are the image sensors 2in which the image sensors 2 in FIGS. 7, 11 and 15 are filled with theresin 261, and the filling with the resin 261 can be applied to others,for example, the image sensors 2 in FIGS. 12 to 14 and the like.

<Manufacturing Method of Image Sensor 2>

FIG. 19 is a diagram illustrating an example of a manufacturing methodof the image sensor 2.

That is, FIG. 19 shows an example of a manufacturing method of the imagesensor 2 in FIG. 7.

In Step S11, a manufacturing apparatus (not shown) which manufacturesthe image sensor 2 manufactures the sensor die 10 and the logic die 20(wafers to become each).

In Step S12, the manufacturing apparatus affixes the sensor die 10 andthe logic die 20 and manufactures the sensor chip 40.

In Step S13, the manufacturing apparatus electrically connects thesensor die 10 and the logic die 20 by forming the chip through electrode105, the connecting wire 106, the insulating films 107 and the like inthe sensor chip 40 (FIG. 4). Moreover, the manufacturing apparatus formsthe OCLs 111 and the CFs 112 on the sensor die 10.

In Step S14, the manufacturing apparatus affixes, for example, a glass281 serving as a supporting substrate, which supports the sensor chip40, to the upper side (sensor die 10 side) of the sensor chip 40 (orperforms temporary bonding). Herein, for example, a Si substrate or thelike can be adopted as the supporting substrate besides the glass 281.

In Step S15, the manufacturing apparatus forms the back surface wires(not shown) connected to the electrodes 42 and the electrodes 42 on thesensor chip 40 supported by the glass 281 serving as the supportingsubstrate.

In Step S16, the manufacturing apparatus thins the glass 281 serving asthe supporting substrate by polishing, etching or the like.Alternatively, the manufacturing apparatus separates the glass 281serving as the supporting substrate from the sensor chip 40.

In Step S17, the manufacturing apparatus affixes the protective glass201 with a size L2 larger than a size L1 of the sensor chip 40 directlyor through the thinned glass 281 to the sensor chip 40 and completes theimage sensor 2 in FIG. 7.

Note that the processings in Steps S11 to S17 can be performed at thewafer level.

However, in the case of attaching the IRCF films 221 (FIG. 12) to theprotective glass 201 or in the case of adopting, for example, theprotective glass 231 (FIG. 13) having the function of the IRCF insteadof the protective glass 201, it is possible to perform the processingsin Steps S11 to S16 at the wafer level and perform the processing in S17after dicing (singulation).

FIG. 20 is a diagram illustrating another example of the manufacturingmethod of the image sensor 2.

That is, FIG. 20 shows an example of a manufacturing method of the imagesensor 2 in FIG. 17.

Note that the case of attaching the IRCF films 221 (FIG. 12) to theprotective glass 211 or the case of adopting, for example, theprotective glass 231 (FIG. 13) having the function of the IRCF insteadof the protective glass 211 is not taken into consideration in FIG. 20to simplify the explanation.

In Step S31, a manufacturing apparatus (not shown) which manufacturesthe image sensor 2 manufactures and singulates the sensor chip 40.

In Step S32, the manufacturing apparatus affixes the sensor chip 40singulated to the protective glass 291 which will later become theprotective glass 211 (FIG. 11) at a predetermined pitch.

In Step S33, the manufacturing apparatus fills the surroundings of thesensor chips 40 on the protective glass 291, to which the sensor chips40 are affixed, with the resin 261 so as to seal the sensor chips 40.

In Step S34, the manufacturing apparatus forms triangular grooves 292 soas to taper portions of the protective glass 291 facing the surroundingsof the sensor chips 40.

In Step S35, the manufacturing apparatus performs the singulation withthe vertices of the triangular grooves 292 as boundaries of thesingulation and completes the image sensor 2 in FIG. 17.

By affixing the protective glass 201, 211 or 231 larger than the sensorchip 40 in size to the sensor chip 40 in which the distance A betweenthe end surface of the sensor chip 40 and the pixel array unit 11 (FIG.7) is shortened as a result of the miniaturization of wirings and thelike as described above, it is possible to prevent a ghost fromoccurring even when the thickness of the protective glass 201 or thelike is set to the thickness that can secure the mechanical rigidityrequired.

Moreover, by affixing the protective glass 211 or 231 with thetrapezoidal cross-sectional shape to the sensor chip, it is possible toprevent a ghost from occurring due to the light (secondary light,tertiary light and the like) via multiple reflections inside theprotective glass 211 and the like.

Furthermore, by depositing the IRCF films 221 (FIG. 12) on theprotective glass 211 or adopting the protective glass 231 which absorbsinfrared rays and functions as the IRCF, it is possible to configure athin camera unit without additionally providing an IRCF.

Further, in the case of adopting the protective glass 211 on which theIRCF films 221 are deposited or the protective glass 231 which absorbsinfrared rays and functions as the IRCF, the protective glass 211 or 231and the sensor chip 40 are both singulated, and the protective glass 211or 231 and the sensor chip 40 are affixed after selecting good pieces.Thus, it is possible to improve the yield of the image sensor 2 as wellas suppress the manufacturing costs.

<Usage Example of Image Sensor>

FIG. 21 is a diagram showing a usage example of using the aforementionedimage sensor 2.

The aforementioned image sensor 2 (and further, the camera unit in FIG.1 having the image sensor 2) can be used in, for example, variousapparatuses (electronic devices) which sense light such as visiblelight, infrared light, ultraviolet light and X-rays as described below.

-   -   An apparatus, such as a digital camera or a portable device with        a camera function, which shoots an image to be used for viewing    -   An apparatus used for traffic, such as an in-vehicle sensor        which shoots the front, rear, surroundings, inside and the like        of an automobile, a surveillance camera which monitors traveling        vehicles and roads, or a distance measuring sensor which        measures the distance between the vehicles, for safe driving        with, for example, automatic stop, recognition of driver's        condition, and the like.    -   An apparatus used for home appliances such as a TV, a        refrigerator or an air conditioner for shooting user's gesture        to perform device operation according to that gesture.    -   An apparatus used for medical care and healthcare, such as an        endoscope, an electron microscope or a device for performing        angiography by receiving infrared light.    -   An apparatus used for security, such as a surveillance camera        used for crime prevention or a camera for personal        authentication use.    -   An apparatus used for beauty care, such as a skin measuring        instrument which shoots skin or a microscope which shoots a        scalp.    -   An apparatus used for sports, such as an action camera or a        wearable camera for sports applications and the like.    -   An apparatus used for agriculture, such as a camera for        monitoring the conditions of fields and crops.

The embodiments of the present technology have been described above, andthe embodiments of the present technology are not limited to the aboveembodiments.

Various modifications can be made in a scope without departing from thegist of the present technology.

In addition, the effects described in the present description are merelyexamples and are not limited, and other effects may be provided.

Note that the present technology may also adopt the followingconfigurations.

<1>

An image sensor including:

a sensor chip having a pixel array unit in which pixels that performphotoelectric conversion are arrayed; and

a plate-like transparent member, is affixed to a side of the pixel arrayunit of the sensor chip and is larger than the sensor chip in size.

<2>

The image sensor according to <1>, in which the transparent member is atransparent member with a trapezoidal cross-sectional shape.

<3>

The image sensor according to <1> or <2>, further including an infraredcult filter (IRCF) film which is attached to the transparent member.

<4>

The image sensor according to <1> or <2>, in which the transparentmember is a transparent member which absorbs infrared rays.

<5>

The image sensor according to any one of <1> to <4>, in which the imagesensor is mounted by wire bonding or flip chip.

<6>

The image sensor according to any one of <1> to <5>, further including alight shielding film which is formed on a peripheral portion of thetransparent member.

<7>

The image sensor according to any one of <1> to <6>, further including aresin which seals surroundings of the sensor chip.

<8>

The image sensor according to any one of <1> to <7>, in which athickness of the transparent member is 200 μm or more.

<9>

A manufacturing method including:

a step of affixing a plate-like transparent member to a side of a pixelarray unit of a sensor chip, the chip having the pixel array unit inwhich pixels that perform photoelectric conversion are arrayed,

in which an image sensor, in which the sensor chip and the transparentmember larger than the sensor chip in size are affixed, is manufactured.

<10>

An electronic device including:

an optical system which collects light; and

an image sensor which receives the light and captures an image,

in which the image sensor includes:

a sensor chip having a pixel array unit in which pixels that performphotoelectric conversion are arrayed; and

a plate-like transparent member is affixed to a side of the pixel arrayunit of the sensor chip and is larger than the sensor chip in size.

REFERENCE SIGNS LIST

-   1 Optical system-   2 Image sensor-   3 Memory-   4 Signal processing unit-   5 Output unit-   6 Control unit-   10 Sensor die-   11 Pixel array unit-   12 Peripheral circuit-   20 Logic die-   30 Memory die-   40 Sensor chip-   41 Protective glass-   42 Electrode-   43 Adhesive-   101 Semiconductor substrate-   102 (Multilayer) wiring layer-   103 Wiring layer-   104 Interlayer insulating film-   105 Chip through electrode-   106 Connecting wire-   107, 108 Insulating film-   109 Silicon through electrode-   110 PD-   111 OCL-   112 CF-   121 Silicon substrate-   122 (Multilayer) wiring layer-   123 Wiring layer-   124 Interlayer insulating film-   201, 211 Protective glass-   221 IRCF film-   231 Protective glass-   241 Light shielding film-   251 Substrate-   252 Wire-   261 Resin-   281 Glass-   291 Protective glass-   292 Groove

The invention claimed is:
 1. A package, comprising: a sensor chip havinga pixel array unit in which pixels that perform photoelectric conversionare arrayed; a plate-like transparent member provided above the pixelarray unit on a second side of the sensor chip, the plate-liketransparent member being larger than the sensor chip in size; and aresin region including resin material provided around side wall portionsof the sensor chip, wherein a length in a horizontal direction of afirst side of the plate-like transparent member affixed to the secondside of the sensor chip is longer than a length in the horizontaldirection of a second side of the plate-like transparent member.
 2. Thepackage according to claim 1, further comprising an adhesive layerprovided between the plate-like transparent member and the sensor chip.3. The package according to claim 1, wherein end portions of theplate-like transparent member extend over the side wall portions of thesensor chip.
 4. The package according to claim 1, further comprisingelectrodes provided on a first side of the sensor chip opposite to thesecond side of the sensor chip.
 5. The package according to claim 2,wherein the adhesive layer affixes the plate-like transparent memberwith the second side of the sensor chip.
 6. The package according toclaim 4, wherein the resin region includes a first side and a secondside, the second side of the resin region being in contact with theplate-like transparent member and the first side of the resin regionbeing free of the electrodes.
 7. The package according to claim 1,wherein the package is mounted by flip chip.
 8. The package according toclaim 1, wherein an edge of the plate-like transparent member iscoincident with an edge of the package.
 9. The package according toclaim 1, wherein the resin region includes a light shielding resinhaving a light shielding property.
 10. A package, comprising: a glasssubstrate; a supporting substrate; a wiring layer formed over a secondside of the supporting substrate; a semiconductor substrate formed overthe wiring layer and having a second side as a light-incident side and afirst side opposite to the second side; an adhesive layer between theglass substrate and the second side of the semiconductor substrate; anda resin region including resin material provided around side wallportions of the semiconductor substrate, the wiring layer and thesupporting substrate, wherein a length in a horizontal direction of afirst side of the glass substrate affixed to the second side of thesemiconductor substrate is longer than a length in the horizontaldirection of a second side of the glass substrate.
 11. The packageaccording to claim 10, further comprising a lens layer provided at thesecond side of the semiconductor substrate.
 12. The package according toclaim 11, further comprising a color filter layer provided between thesecond side of the semiconductor substrate and the lens layer.
 13. Thepackage according to claim 10, wherein end portions of the glasssubstrate extend over the side wall portions of the semiconductorsubstrate, the wiring layer and the supporting substrate.
 14. Thepackage according to claim 10, further comprising electrodes provided ona first side of the supporting substrate opposite to the second side ofthe supporting substrate.
 15. The package according to claim 10, whereinthe adhesive layer affixes the glass substrate with the second side ofthe semiconductor substrate.
 16. The package according to claim 10,wherein the supporting substrate is a silicon substrate.
 17. The packageaccording to claim 14, wherein the resin region includes a first sideand a second side, the second side of the resin region being in contactwith the first side of the glass substrate and the first side of theresin region being free of the electrodes.
 18. The package according toclaim 10, wherein the semiconductor substrate includes a pixel array.19. The package according to claim 10, wherein the package is mounted byflip chip.
 20. The package according to claim 10, wherein an edge of theglass substrate is coincident with an edge of the package.
 21. Thepackage according to claim 10, wherein the resin region includes a lightshielding resin having a light shielding property.
 22. A manufacturingmethod of a package, comprising: affixing a plate-like transparentmember to a second side of a pixel array unit of a sensor chip, thesensor chip having the pixel array unit in which pixels that performphotoelectric conversion are arrayed, the transparent plate-like memberbeing larger than the sensor chip in size; and forming a resin regionincluding resin material provided around side wall portions of thesensor chip, wherein a length in a horizontal direction of a first sideof the plate-like transparent member affixed to the second side of thepixel array unit of the sensor chip is longer than a length in thehorizontal direction of a second side of the plate-like transparentmember.
 23. The manufacturing method according to claim 22, furthercomprising affixing electrodes on a first side of the sensor chipopposite to the second side of the sensor chip.
 24. The manufacturingmethod according to claim 23, further comprising affixing a second sideof the resin region to the plate-like transparent member and maintaininga first side of the resin region to be free of the electrodes.
 25. Themanufacturing method according to claim 22, wherein the resin regionincludes a light shielding resin having a light shielding property. 26.The manufacturing method according to claim 22, wherein an edge of theplate-like transparent member is coincident with an edge of the resinregion.